US 11,899,366 B2
Method and apparatus for post exposure processing of photoresist wafers
Viachslav Babayan, Sunnyvale, CA (US); Douglas A. Buchberger, Jr., Livermore, CA (US); Qiwei Liang, Fremont, CA (US); Ludovic Godet, Sunnyvale, CA (US); Srinivas D. Nemani, Sunnyvale, CA (US); Daniel J. Woodruff, Kalispell, MT (US); Randy Harris, Kalispell, MT (US); and Robert B. Moore, Bigfork, MT (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 7, 2021, as Appl. No. 17/468,536.
Application 17/468,536 is a division of application No. 16/272,962, filed on Feb. 11, 2019, granted, now 11,112,697.
Application 16/272,962 is a division of application No. 14/989,488, filed on Jan. 6, 2016, granted, now 10,203,604, issued on Feb. 12, 2019.
Claims priority of provisional application 62/267,531, filed on Dec. 15, 2015.
Claims priority of provisional application 62/261,171, filed on Nov. 30, 2015.
Prior Publication US 2022/0004104 A1, Jan. 6, 2022
Int. Cl. G03F 7/16 (2006.01); G03F 7/26 (2006.01); G03F 7/38 (2006.01); H01L 21/67 (2006.01); G03F 7/40 (2006.01); H01L 21/687 (2006.01); G03F 7/20 (2006.01)
CPC G03F 7/2035 (2013.01) [G03F 7/168 (2013.01); G03F 7/26 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01); H01L 21/67017 (2013.01); H01L 21/67103 (2013.01); H01L 21/68764 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a chamber body defining a process volume;
a pedestal disposed in the process volume;
a first electrode adapted to support a substrate;
a ring disposed radially outward of the first electrode;
a bearing coupled to the chamber body and disposed opposite the first electrode;
a stem, rotatably coupled to the bearing, the stem rotatable about an axis parallel to the first electrode; and
a second electrode coupled to the stem.