US 11,899,364 B2
Photosensitive polyimide compositions
Binod B. De, Attleboro, MA (US); Sanjay Malik, Attleboro, MA (US); Raj Sakamuri, Sharon, MA (US); William A. Reinerth, Riverside, RI (US); Ognian N. Dimov, Warwick, RI (US); and Ahmad A. Naiini, East Greenwich, RI (US)
Assigned to Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US)
Filed by Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US)
Filed on Mar. 18, 2020, as Appl. No. 16/822,072.
Application 16/822,072 is a continuation of application No. 15/132,472, filed on Apr. 19, 2016, abandoned.
Claims priority of provisional application 62/263,372, filed on Dec. 4, 2015.
Claims priority of provisional application 62/185,424, filed on Jun. 26, 2015.
Claims priority of provisional application 62/150,381, filed on Apr. 21, 2015.
Prior Publication US 2020/0218152 A1, Jul. 9, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/038 (2006.01); G03F 7/32 (2006.01); G03C 1/805 (2006.01); G03F 7/34 (2006.01); B29C 67/00 (2017.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); C09D 179/08 (2006.01); C08G 73/10 (2006.01); G03F 7/037 (2006.01); G03F 7/11 (2006.01); G03F 7/16 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/0387 (2013.01) [B29C 67/00 (2013.01); C08G 73/1014 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08G 73/1067 (2013.01); C09D 179/08 (2013.01); G03C 1/805 (2013.01); G03F 7/037 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/325 (2013.01); G03F 7/343 (2013.01); H01L 21/0273 (2013.01); H01L 21/02118 (2013.01); H01L 21/311 (2013.01)] 22 Claims
 
1. A dry film structure, comprising:
a carrier substrate;
a first polymeric layer supported by the carrier substrate, wherein the first polymeric layer is a photosensitive polymeric layer, and the photosensitive polymeric layer comprises at least one fully imidized polyimide polymer; and
a second polymeric layer, wherein the second polymeric layer is between the photosensitive polymeric layer and the carrier substrate and the second polymeric layer consists of at least one water soluble polymer;
wherein the photosensitive polymeric layer has a film thickness of at most about 5 microns.