US 11,899,255 B2
Optical printed circuit board and its fabricating method
Kin Seng Chiang, Kowloon (HK); Wei Jin, New Territories (HK); Kar Pong Lor, Ap Lei Chau (HK); and Hau Ping Chan, New Territories (HK)
Assigned to City University of Hong Kong, Kowloon (HK)
Filed by City University of Hong Kong, Kowloon (HK)
Filed on Jun. 17, 2022, as Appl. No. 17/843,102.
Prior Publication US 2023/0408779 A1, Dec. 21, 2023
Int. Cl. G02B 6/42 (2006.01); G02B 6/38 (2006.01)
CPC G02B 6/4292 (2013.01) [G02B 6/3897 (2013.01); G02B 6/4231 (2013.01); G02B 6/3829 (2013.01); G02B 6/4243 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method for fabricating an optical printed circuit board (OPCB), comprising:
preparing a first printed circuit board portion with an array of optical fibers attached thereon;
assembling an optical fiber connector with the first printed circuit board portion such that the optical fiber connector is arranged at ends of the array of optical fibers; and
attaching one or more second printed circuit board portions to the first printed circuit board portion to form an optical printed circuit board with the optical fiber connector embedded therein,
wherein the optical fiber connector comprises an engagement mechanism arranged for engagement with an external optical device.