CPC G02B 5/08 (2013.01) [B81B 3/00 (2013.01); C03C 25/223 (2013.01); G02B 1/10 (2013.01); G02B 5/20 (2013.01); G02B 26/0833 (2013.01); G02B 27/0977 (2013.01)] | 17 Claims |
1. A method for manufacturing optical apparatus, the method comprising:
pre-preparing MEMS chips, without any QWP coating, including manufacturing a stock of optical MEMS elements, and
subsequently, according to customers' needs, adding QWP coatings to the MEMS chips as pre-prepared, wherein said adding includes, for at least first and second orders O1 and O2 respectively, from among a stream of orders, each order requiring a specific number of devices having a given number G of optical elements and having specific requirements in terms of active optical coatings required:
selecting G1 diced optical mems elements E1, from the stock, each of which include N1 optical elements where N1 is the number of optical elements required by order O1;
depositing active optical coatings that achieve requirements of said order O1, atop each of the diced optical MEMS elements E1 selected from the stock for order O1, thereby to fill order O1;
selecting G2 diced optical mems elements E2, from the stock, each of which include N2 optical elements where N2 is the number of optical elements required by order O2; and
depositing active optical coatings that achieve requirements of said order O2, atop each of the diced optical mems elements E2 selected from the stock for order O2, thereby to fill order O2,
wherein at least one active optical coating comprises a QWP coating,
wherein a hard mask is used to add QWP coating to the MEMS chips as pre-prepared,
wherein the hard mask is aligned to at least one MEMS element under a microscope, and
wherein at least one MEMS element is pushed, under a microscope, under the hard mask including performing microscopic-level alignment of the MEMS element with the hard mask.
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