CPC G01P 15/09 (2013.01) [G01P 1/00 (2013.01); H04R 17/00 (2013.01); H04R 19/04 (2013.01); H10N 30/302 (2023.02); H10N 30/306 (2023.02); H10N 30/802 (2023.02); H10N 30/853 (2023.02); H10N 30/877 (2023.02); H04R 2201/003 (2013.01)] | 20 Claims |
1. A packaged micro electromechanical system (MEMS) device comprising:
a package having a compartment; and
a MEMS die disposed in the compartment, the MEMS die supporting a MEMS accelerometer formed by a first structure and a MEMS microphone formed by a second structure different from the first structure;
wherein the MEMS accelerometer comprises:
a spacer layer;
at least a first tapered cantilever beam element having a base portion and a tip portion, the base portion attached to the spacer layer, wherein at least the first tapered cantilever beam element is supported over and spaced from a substrate of the MEMS die by the spacer layer, with at least the first tapered cantilever beam element tapering in width from the base portion, and with at least the first tapered cantilever beam element further comprising:
at least a first layer comprised of a piezoelectric material;
a pair of electrically conductive layers disposed on opposing surfaces of the first layer, wherein at least one conductive layer of the pair of electrically conductive layers has an electrical discontinuity to provide an electrically active portion of at least the first tapered cantilever beam element and an electrically inactive portion of at least the first tapered cantilever beam element; and
a mass element supported at the tip portion of at least the first tapered cantilever beam element.
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