US 11,898,808 B2
Support plate thin cladding
Robert F. Meyer, Palo Alto, CA (US); William A. Counts, Sunnyvale, CA (US); Michael D. Quinones, Campbell, CA (US); Jason P. Shannon, Sunnyvale, CA (US); and David A. Pakula, San Francisco, CA (US)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Dec. 9, 2019, as Appl. No. 16/708,159.
Claims priority of provisional application 62/897,668, filed on Sep. 9, 2019.
Claims priority of provisional application 62/835,931, filed on Apr. 18, 2019.
Prior Publication US 2020/0337184 A1, Oct. 22, 2020
Int. Cl. B29D 22/00 (2006.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); H05K 7/20 (2006.01)
CPC F28F 21/02 (2013.01) [F28F 21/081 (2013.01); F28F 21/085 (2013.01); H05K 7/20436 (2013.01); H05K 7/20472 (2013.01); H05K 7/20481 (2013.01); H05K 7/20509 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a housing; and
a support component joined to the housing, the support component comprising:
a thermal conduction layer, the thermal conduction layer comprising a first layer of a first thermally conductive material disposed on a first surface of a second thermally conductive material and a second layer of the first thermally conductive material disposed on a second surface of the second thermally conductive material opposite the first layer of the first thermally conductive material, the second thermally conductive material disposed between the first layer and the second layer of the first thermally conductive material, wherein the first layer of the first thermally conductive material and the second layer of the first thermally conductive material are physically coupled via a portion of the first thermally conductive material extending through the second thermally conductive material; and
a support structure joined to at least one surface of the thermal conduction layer;
a ratio of a thickness of the thermal conduction layer to a thickness of the support structure being at least 1.5.