US 11,898,246 B2
Vapor deposition device
Naoyuki Wada, Tokyo (JP); and Yu Minamide, Tokyo (JP)
Assigned to SUMCO CORPORATION, Tokyo (JP)
Appl. No. 17/415,410
Filed by SUMCO CORPORATION, Tokyo (JP)
PCT Filed Nov. 5, 2019, PCT No. PCT/JP2019/043259
§ 371(c)(1), (2) Date Jun. 17, 2021,
PCT Pub. No. WO2020/137169, PCT Pub. Date Jul. 2, 2020.
Claims priority of application No. 2018-244822 (JP), filed on Dec. 27, 2018.
Prior Publication US 2022/0056581 A1, Feb. 24, 2022
Int. Cl. H01L 21/67 (2006.01); C23C 16/458 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC C23C 16/458 (2013.01) [H01L 21/67201 (2013.01); H01L 21/67742 (2013.01); H01L 21/68707 (2013.01); H01L 21/68742 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A vapor deposition device comprising a plurality of robots configured to:
transport a plurality of before-treatment wafers from a wafer storage container, through a factory interface, load-lock chamber, and wafer transfer chamber, to a reaction chamber in that order, and
transport a plurality of after-treatment wafers from the reaction chamber, through the wafer transfer chamber, load-lock chamber, and factory interface, to the wafer storage container in that order, wherein:
the load-lock chamber communicates with the factory interface via a first door and also communicates with the wafer transfer chamber via a second door,
the wafer transfer chamber communicates, via a gate valve, with the reaction chamber in which a CVD film is formed on the wafer,
the plurality of robots comprises a first robot provided with the wafer transfer chamber and a second robot provided with the factory interface,
the vapor deposition device further comprises a plurality of ring-shaped carriers each which support an outer edge of a wafer,
the first robot deposits a before-treatment wafer transported into the load-lock chamber into the reaction chamber in a state where the before-treatment wafer is mounted on a carrier of the plurality of carriers, and also withdraws an after-treatment wafer for which treatment in the reaction chamber has ended from the reaction chamber in a state where the after-treatment wafer is mounted on a carrier of the plurality of carriers and transports the wafer to the load-lock chamber,
the second robot extracts a before-treatment wafer from the wafer storage container and mounts the wafer on a carrier of the plurality of carriers standing by in the load-lock chamber, and also stores in the wafer storage container an after-treatment wafer mounted on the carrier of the plurality of carriers that has been transported to the load-lock chamber,
the load-lock chamber is provided with a first holder that supports a carrier of the plurality of carriers at a topmost-level and a second holder that supports a carrier of the plurality of carriers under the first holder, and
the second robot mounts the before-treatment wafer extracted from the wafer storage container on the carrier of the plurality of carriers standing by at the first holder in the load-lock chamber.