US 11,898,245 B2
High throughput and metal contamination control oven for chamber component cleaning process
Chien-Min Liao, San Jose, CA (US); Chi-Feng Liu, Chubei (TW); Yi Nung Wu, Hsinchu (TW); Hsiu Yang, Santa Clara, CA (US); Yixing Lin, Saratoga, CA (US); Boon Sen Chan, Singapore (SG); and Siamak Salimian, Los Altos, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 26, 2021, as Appl. No. 17/187,218.
Prior Publication US 2022/0275505 A1, Sep. 1, 2022
Int. Cl. C23C 16/44 (2006.01); C23C 16/455 (2006.01); H05B 1/02 (2006.01)
CPC C23C 16/4405 (2013.01) [C23C 16/4412 (2013.01); C23C 16/45565 (2013.01); H05B 1/0233 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A baking chamber for processing a chamber component, comprising:
an enclosure defining a first chamber, wherein the first chamber comprises:
a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume;
a first support disposed in the first interior volume for supporting a chamber component, the first support comprising a pedestal coupled to a shaft;
a first gas line disposed in the first interior volume proximate the first lid and configured to supply one or more process gases into the first interior volume;
a first showerhead disposed between the first gas line and the first support, wherein the first showerhead includes a plurality of holes configured to direct the one or more process gases from the first gas line to a region between the first showerhead and the first support;
a first exhaust coupled to the first floor radially inward of an outer surface of the shaft, wherein the first showerhead and the first exhaust are configured to provide a gas curtain that flows from the first showerhead to the chamber component, around the chamber component, and into the first exhaust during use; and
a first heater disposed in the first interior volume between the first support and the first floor; and
wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.