US 11,898,065 B2
Resin composition for sealant, laminate, packaging material, and package
Koichi Nishijima, Ichihara (JP); Hiroaki Machiya, Ichihara (JP); Hisao Gonohe, Ichihara (JP); and Yoshitaka Hironaka, Ichihara (JP)
Assigned to DOW-MITSUI POLYCHEMICALS CO., LTD., Tokyo (JP)
Appl. No. 17/293,504
Filed by DOW-MITSUI POLYCHEMICALS CO., LTD., Tokyo (JP)
PCT Filed Nov. 19, 2019, PCT No. PCT/JP2019/045273
§ 371(c)(1), (2) Date May 13, 2021,
PCT Pub. No. WO2020/110829, PCT Pub. Date Jun. 4, 2020.
Claims priority of application No. 2018-225788 (JP), filed on Nov. 30, 2018.
Prior Publication US 2021/0403770 A1, Dec. 30, 2021
Int. Cl. B32B 1/02 (2006.01); C09J 123/08 (2006.01); B32B 1/00 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B65D 65/40 (2006.01); C08L 23/08 (2006.01); B32B 1/08 (2006.01)
CPC C09J 123/0869 (2013.01) [B32B 1/00 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B65D 65/40 (2013.01); C08L 23/0869 (2013.01); B32B 2250/03 (2013.01); B32B 2250/246 (2013.01); B32B 2307/31 (2013.01); B32B 2439/40 (2013.01); C08L 2203/162 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01); C08L 2310/00 (2013.01)] 11 Claims
 
1. A resin composition for a sealant, comprising:
a resin (A) that is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass;
a tackifying resin (B) having a ring and ball method softening point of from 100° C. to 130° C.;
a resin (C) that is an ethylene-vinyl ester copolymer in which a content of a vinyl ester unit with respect to a total amount of the ethylene-vinyl ester copolymer is from 7% by mass to 13% by mass;
a resin (D) that is at least one selected from the group consisting of an ethylene-α-olefin copolymer elastomer and a styrene-based elastomer; and
an erucic acid amide,
wherein a density of the ethylene-α-olefin copolymer elastomer is from 850 kg/m3 to less than 900 kg/m3,
a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant,
a content of the tackifying resin (B) is from 0.1% by mass to 3% by mass with respect to a total amount of resin components in the resin composition for a sealant,
a content of the erucic acid amide is from 0.01% by mass to 0.096% by mass with respect to a total amount of resin components in the resin composition for a sealant,
a total content of resin components is 80% by mass or more with respect to a total amount of the resin composition for a sealant, and
an elution amount of the resin composition for a sealant into normal heptane is 30 μg/mL or less.