US 11,897,998 B2
Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device
Yoshinori Nishitani, Tokyo (JP); Masaki Minami, Tokyo (JP); and Tatsuki Sato, Tokyo (JP)
Assigned to ENEOS Corporation, Tokyo (JP)
Appl. No. 16/759,677
Filed by ENEOS Corporation, Tokyo (JP)
PCT Filed Oct. 26, 2018, PCT No. PCT/JP2018/039821
§ 371(c)(1), (2) Date Apr. 27, 2020,
PCT Pub. No. WO2019/083003, PCT Pub. Date May 2, 2019.
Claims priority of application No. 2017-208602 (JP), filed on Oct. 27, 2017.
Prior Publication US 2020/0291173 A1, Sep. 17, 2020
Int. Cl. C08G 59/62 (2006.01)
CPC C08G 59/621 (2013.01) 20 Claims
 
1. A curable resin composition containing:
(A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the multifunctional benzoxazine compound being at least one multifunctional benzoxazine compound selected from
(1) a multifunctional benzoxazine compound having a structural unit of formula (1)

OG Complex Work Unit Chemistry
wherein R represents a linear alkyl group having 1 to 12 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms, or an aryl group having 6 to 14 carbon atoms, where the aryl group optionally has halogen or a linear alkyl group having 1 to 12 carbon atoms, as a substituent, and each Z represents hydrogen, a hydrocarbon group having 1 to 8 carbon atoms and/or a linking group and is optionally the same or different, wherein at least one Z represents a linking group, and benzoxazine rings are linked by the linking group; and
(2) a multifunctional benzoxazine compound represented by a structure of formula (2)

OG Complex Work Unit Chemistry
wherein L represents a divalent organic group having 1 to 5 aromatic rings or an alkylene group having 2 to 10 carbon atoms, and the organic group and the alkylene group optionally comprise oxygen and/or sulfur,
(B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, wherein the epoxy compound is at least one compound selected from

OG Complex Work Unit Chemistry
(C) a trisphenolmethane type epoxy compound, and
(D) a curing agent,
wherein the curable resin composition has a compounding ratio between component (A) and a total of component (B) and component (C) of 5 parts by mass or more and 150 parts by mass or less, where the compounding ratio is determined by the total of component (B) and component (C) based on 100 parts by mass of component (A), and
wherein the curable resin composition has an epoxy equivalent ratio of 0.5 or more and 1.5 or less, where the epoxy equivalent ratio is determined by [total number of epoxy groups in components (B) and (C)]/[number of cyanato groups in component (A)+number of hydroxyl groups in component (D)].