CPC C08F 220/1811 (2020.02) [C08F 2/44 (2013.01); C08F 2/50 (2013.01); C08F 220/325 (2020.02); C08K 5/005 (2013.01); C08K 5/17 (2013.01); F21K 9/68 (2016.08); G02B 1/04 (2013.01); G02B 5/0268 (2013.01); F21S 43/33 (2018.01); F21Y 2115/10 (2016.08)] | 15 Claims |
1. An optical resin comprising:
in the optical resin disposed on a surface of a molding member sealing a light emitting chip or a surface of a light emitting device having a light emitting chip,
oligomers, monomers and additives;
wherein the monomer include acrylate having an epoxy group without using acrylate having a hydroxyl group,
the monomer includes IBOA (Iso-bornyl Acrylate), two or more dilution monomers, and glycidyl methacrylate (GMA),
wherein the additive includes a photoinitiator of ultraviolet wavelength and an amine-based light stabilizer,
wherein in the oligomer and the monomer, a content of the oligomer is 20-25%, a content of the IBOA is 40-50%, a content of the two or more dilution monomers is 10-20%, and a content of the glycidyl methacrylate is 10 to 15%,
wherein the optical resin is a curable transparent resin, and
wherein a content of the monomer in the optical resin is three times higher than the content of the oligomer.
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