US 11,897,758 B2
Electrical contacting and method for producing an electrical contacting
Jochen Reinmuth, Reutlingen (DE); Markus Kuhnke, Wannweil (DE); Stefan Majoni, Weil Im Schoenbuch (DE); and Timo Schary, Aichtal-Neuenhaus (DE)
Assigned to ROBERT BOSCH GMBH, Stuttgart (DE)
Appl. No. 17/252,044
Filed by Robert Bosch GmbH, Stuttgart (DE)
PCT Filed Jun. 25, 2019, PCT No. PCT/EP2019/066921
§ 371(c)(1), (2) Date Dec. 14, 2020,
PCT Pub. No. WO2020/002385, PCT Pub. Date Jan. 2, 2020.
Claims priority of application No. 102018210815.3 (DE), filed on Jun. 30, 2018.
Prior Publication US 2021/0261404 A1, Aug. 26, 2021
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01)
CPC B81B 7/007 (2013.01) [B81C 1/00301 (2013.01); B81B 2207/092 (2013.01); B81B 2207/095 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electrical contacting between a surrounding wiring and a conductor region, the conductor region being situated in a conductor layer above an SOI wafer or SOI chip, a cover layer being situated above the conductor layer and below the surrounding wiring, the cover layer having a contacting region, the contacting region being insulated from the rest of the cover layer by a first configuration of recesses, an opening is formed at least in the contacting region, a metallic material is situated in the opening, and the metallic material connects the surrounding wiring and the conductor region, wherein the conductor region is separated from a further conductor region by a second configuration of recesses, wherein the conductor region is insulated from the further conductor region by the second configuration of recesses.