US 11,897,705 B2
Workpiece processing method
Takao Miyazawa, Shimosuwa-Machi (JP); Mitsuhiro Yamamura, Suwa (JP); and Noboru Asauchi, Yamagata-Mura (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Apr. 23, 2021, as Appl. No. 17/238,237.
Claims priority of application No. 2020-077535 (JP), filed on Apr. 24, 2020.
Prior Publication US 2021/0331874 A1, Oct. 28, 2021
Int. Cl. B65G 47/90 (2006.01); B23Q 5/22 (2006.01)
CPC B65G 47/90 (2013.01) [B23Q 5/22 (2013.01); Y10T 29/49769 (2015.01); Y10T 29/49998 (2015.01)] 11 Claims
OG exemplary drawing
 
1. A workpiece processing method, the method comprising:
a carry-in step of carrying a workpiece placed in a tray on a placement seat outside a field of view of a magnifier into the field of view of the magnifier according to a shape, a position, and an attitude of the workpiece in the tray detected based on an image data obtained by capturing an image of a region around and outside the field of view of the magnifier using a peripheral camera disposed in a position above the magnifier,
a work step of performing predetermined work on the workpiece based on an image data provided via the magnifier; and
a carry-out step of carrying the workpiece having undergone the work step out of the field of view of the magnifier into another tray on the placement seat according to a position of another tray detected based on the image data obtained by capturing the region around and outside the field of view of the magnifier using the peripheral camera,
wherein a robot performs the work step, the carry-in step and the carry-out step.