US 11,897,080 B2
Polishing apparatus
Masashi Kabasawa, Tokyo (JP); Yasuyuki Motoshima, Tokyo (JP); Hisanori Matsuo, Tokyo (JP); and Keisuke Kamiki, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Oct. 8, 2020, as Appl. No. 17/065,787.
Claims priority of application No. 2019-189304 (JP), filed on Oct. 16, 2019.
Prior Publication US 2021/0114164 A1, Apr. 22, 2021
Int. Cl. B24B 37/015 (2012.01); B24B 37/20 (2012.01); B24B 37/013 (2012.01)
CPC B24B 37/015 (2013.01) [B24B 37/013 (2013.01); B24B 37/20 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A polishing apparatus, comprising:
a polishing pad having a polishing surface,
a polishing table configured to support the polishing pad;
a polishing head configured to press a substrate against the polishing pad;
a non-contact pad-temperature regulating device arranged above the polishing pad;
a pad-temperature measuring device configured to measure a surface temperature of the polishing pad, the pad-temperature measuring device being arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of the polishing table;
an atomizer configured to clean the polishing surface of the polishing pad; and
a controller configured to control the pad-temperature regulating device based on the surface temperature of the polishing pad measured by the pad-temperature measuring device,
wherein the pad-temperature measuring device is arranged on the downstream side of the pad-temperature regulating device and on an upstream side of the atomizer, and
wherein when a region between the atomizer and the pad-temperature regulating device is defined as a temperature control stable region, the pad-temperature measuring device is arranged in the temperature control stable region, and the polishing head is arranged in a region outside the temperature control stable region.