US 11,896,830 B2
Sealed package and method of forming same
Andrew J. Thom, Maple Grove, MN (US); Rajesh V. Iyer, Eden Prairie, MN (US); Gordon O. Munns, Stacy, MN (US); Christian S. Nielsen, River Falls, WI (US); and Andrew J. Ries, Lino Lakes, MN (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by Medtronic, Inc., Minneapolis, MN (US)
Filed on Feb. 2, 2021, as Appl. No. 17/164,998.
Application 17/164,998 is a continuation of application No. 16/021,177, filed on Jun. 28, 2018, granted, now 10,918,874.
Prior Publication US 2021/0154484 A1, May 27, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/375 (2006.01); A61N 1/372 (2006.01); H02J 50/10 (2016.01); H02J 7/00 (2006.01); H02J 50/00 (2016.01)
CPC A61N 1/37223 (2013.01) [A61N 1/3754 (2013.01); A61N 1/3758 (2013.01); A61N 1/37518 (2017.08); H02J 7/00034 (2020.01); H02J 50/10 (2016.02); H02J 50/005 (2020.01)] 20 Claims
OG exemplary drawing
 
1. A hermetically-sealed package comprising a housing that extends along a housing axis between a first end and a second end, wherein the housing comprises first and second opaque portions and a transparent portion disposed between the first and second opaque portions, wherein the first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion, wherein at least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring.