	US 11,896,694 B2
	Compositions for removing nail polish
Aline Aude Guimont, Westfield, NJ (US); Chunhua Li, Hillsborough, NJ (US); Hubert Tunchiao Lam, Berkeley Heights, NJ (US); and Derek James Henry, Montclair, NJ (US)
Assigned to L'OREAL, Paris (FR)
Filed by L'OREAL, Paris (FR)
Filed on Jan. 4, 2021, as Appl. No. 17/140,567.
Application 17/140,567 is a continuation of application No. 16/117,610, filed on Aug. 30, 2018, granted, now 10,912,724.
Claims priority of provisional application 62/592,893, filed on Nov. 30, 2017.
Prior Publication US 2021/0121377 A1, Apr. 29, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. A61Q 3/04 (2006.01); A61K 8/34 (2006.01); A61K 8/49 (2006.01); A61K 8/60 (2006.01); A61K 8/81 (2006.01)

CPC A61K 8/345 (2013.01) [A61K 8/34 (2013.01); A61K 8/4973 (2013.01); A61K 8/60 (2013.01); A61K 8/8152 (2013.01); A61K 8/8158 (2013.01); A61Q 3/04 (2013.01); A61K 2800/28 (2013.01); A61K 2800/30 (2013.01); A61K 2800/31 (2013.01); A61K 2800/48 (2013.01)]

20 Claims

1. A composition for removing nail polish comprising at least about 10% by weight of at least one polyhydric alcohol compound, at least 10% by weight of at least one C2-C5 alcohol, at least 15% by weight of at least one high boiling point ester compound, at least one thickening agent, and at least 5% by weight of at least one water-soluble abrasive having a hardness which provides mechanical exfoliation during said removing of nail polish, wherein the composition comprises less than about 5% by weight of oil, all weights being based on the weight of the composition.