US 12,225,832 B2
Method for fabricating air bridge, air bridge structure, and superconducting quantum chip
Wenlong Zhang, Guangdong (CN); Sainan Huai, Guangdong (CN); Yarui Zheng, Guangdong (CN); Jiagui Feng, Guangdong (CN); Kanglin Xiong, Guangdong (CN); and Sunan Ding, Guangdong (CN)
Assigned to TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED, Shenzhen (CN); and SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES, Suzhou (CN)
Filed by TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED, Guangdong (CN); and SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINANO), CHINESE ACADEMY OF SCIENCES, Jiangsu (CN)
Filed on Mar. 25, 2022, as Appl. No. 17/704,717.
Application 17/704,717 is a continuation of application No. PCT/CN2021/121480, filed on Sep. 28, 2021.
Claims priority of application No. 202011309305.2 (CN), filed on Nov. 20, 2020.
Prior Publication US 2022/0216390 A1, Jul. 7, 2022
Int. Cl. H10N 60/83 (2023.01); H10N 60/01 (2023.01); H10N 60/81 (2023.01); H10N 60/82 (2023.01); H10N 69/00 (2023.01)
CPC H10N 60/83 (2023.02) [H10N 60/0884 (2023.02); H10N 60/81 (2023.02); H10N 60/82 (2023.02); H10N 69/00 (2023.02)] 13 Claims
OG exemplary drawing
 
1. A method for fabricating an air bridge, comprising:
forming an air bridge brace structure on a substrate;
forming, on the air bridge brace structure and the substrate, an air bridge material layer with one or more openings in the air bridge material layer that reveal the air bridge brace structure, the air bridge material layer with the one or more openings being formed based on a patterned photoresist layer with patterns corresponding to the one or more openings; and
removing, based on the one or more openings in the air bridge material layer, the air bridge brace structure to obtain the air bridge having the one or more openings, wherein the one or more openings includes at least one of an opening in an approach bridge portion of the air bridge or an opening in a pier portion of the air bridge.