CPC H10N 30/092 (2023.02) [H10N 30/852 (2023.02)] | 6 Claims |
1. A method of fabricating a piezoelectric composite, the method comprising:
an electrode plate preparing operation of preparing a first electrode plate;
a support member arranging operation of locating a support member formed with a plurality of through holes on one surface of the first electrode plate; and
a piezoelectric pillar inserting operation of inserting a plurality of piezoelectric pillars having shapes respectively corresponding to the through holes and being previously generated by sintering piezoelectric pellets into the through holes;
a piezoelectric pillar lower surface adhering operation of adhering lower surfaces of the plurality of piezoelectric pillars respectively to the one surface of the first electrode plate by applying a load to upper surfaces of the plurality of piezoelectric pillars respectively;
a support member removing operation of removing the support member;
a piezoelectric pillar upper surface adhering operation of adhering the upper surfaces of the plurality of piezoelectric pillars respectively to one surface of a second electrode plate by applying a load to the other surface of the second electrode plate;
a polymer filling operation of filling the periphery of the plurality of piezoelectric pillars with a polymer;
wherein the piezoelectric pillar lower surface adhering operation and the piezoelectric pillar upper surface adhering operation further include an operation of heating for 30 to 90 minutes at a temperature of 100° C. to 130° C.
|