CPC H10N 30/01 (2023.02) [B81B 3/0021 (2013.01); B81C 1/00134 (2013.01); H04R 17/02 (2013.01); H04R 17/10 (2013.01); H10N 30/302 (2023.02); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01)] | 18 Claims |
1. A method of making a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone, comprising:
forming or providing a mold extending along a length and having one or more grooves in a top surface of the mold, the one or more grooves extending in a direction of the length of the mold to a distal end of the mold;
forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the grooves of the mold;
forming a gap in the structure to define two beams with free ends separated by the gap; and
releasing the structure from the mold to form two cantilever beams having said free ends separated by the gap, the two cantilever beams configured to move independently of each other.
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