US 12,225,752 B2
Encapsulating cover plate, fabrication method thereof, display panel and fabrication method thereof
Juanjuan You, Beijing (CN); and Li Sun, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/293,636
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed May 27, 2020, PCT No. PCT/CN2020/092563
§ 371(c)(1), (2) Date May 13, 2021,
PCT Pub. No. WO2020/238947, PCT Pub. Date Dec. 3, 2020.
Claims priority of application No. 201910472237.2 (CN), filed on May 31, 2019.
Prior Publication US 2022/0013745 A1, Jan. 13, 2022
Int. Cl. H10K 50/824 (2023.01); H10K 59/12 (2023.01); H10K 59/122 (2023.01); H10K 71/13 (2023.01); H10K 71/60 (2023.01); H10K 102/00 (2023.01)
CPC H10K 50/824 (2023.02) [H10K 59/122 (2023.02); H10K 71/135 (2023.02); H10K 71/60 (2023.02); H10K 59/1201 (2023.02); H10K 2102/3026 (2023.02)] 18 Claims
OG exemplary drawing
 
1. An encapsulating cover plate for an organic light emitting diode (OLED) display panel, comprising:
a first base substrate;
a first auxiliary electrode on the first base substrate; and
a second auxiliary electrode on a side of the first auxiliary electrode away from the first base substrate, an orthographic projection of the second auxiliary electrode on the first base substrate being within an orthographic projection of the first auxiliary electrode on the first base substrate,
wherein a material of the first auxiliary electrode comprises an organic conductive polymer, and a material of the second auxiliary electrode comprises a conductive metal, and
the orthographic of the first auxiliary electrode on the first base substrate does not overlap an orthographic projection of a first electrode of an OLED device on the first base substrate.