US 12,225,732 B2
Multi-stack ferroelectric memory structure
Stefan Ferdinand Müller, Radebeul (DE)
Assigned to FERROELECTRIC MEMORY GMBH, Dresden (DE)
Filed by Ferroelectric Memory GmbH, Dresden (DE)
Filed on May 11, 2022, as Appl. No. 17/663,003.
Prior Publication US 2023/0371268 A1, Nov. 16, 2023
Int. Cl. H10B 51/30 (2023.01); H10B 51/20 (2023.01)
CPC H10B 51/30 (2023.02) [H10B 51/20 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A memory device comprising:
a plurality of gate layer stacks, wherein each gate layer stack of the plurality of gate layer stacks comprises a gate electrode layer and one or more electrically insulating layers;
one or more channel structures extending through the plurality of gate layer stacks,
wherein the plurality of gate layer stacks and the one or more channel structures correspond to a plurality of field-effect transistor based memory cells of the memory device,
wherein a first field-effect transistor based memory cell of the plurality of field-effect transistor based memory cells comprises:
a first gate layer portion of a first gate layer stack of the plurality of gate layer stacks;
a first channel portion of a channel structure of the one or more channel structures;
a spontaneously-polarizable portion; and
a first floating gate,
wherein the spontaneously-polarizable portion and the first floating gate are disposed between the first gate layer portion and the first channel portion, and
wherein a height of the spontaneously-polarizable portion is less than a height of the first floating gate when measured along an axis parallel to a longitudinal axis of the one or more channel structures.