CPC H10B 12/00 (2023.02) [G11C 29/52 (2013.01); H01L 29/7869 (2013.01)] | 3 Claims |
1. A memory device comprising:
a first element layer comprising a memory cell;
a second element layer comprising an error detection circuit;
a semiconductor substrate comprising a driver circuit; and
a sense amplifier and a precharge circuit,
wherein the second element layer is positioned between the semiconductor substrate and the first element layer,
wherein the memory cell comprises a first transistor,
wherein the error detection circuit comprises a second transistor,
wherein the driver circuit comprises a third transistor,
wherein the sense amplifier comprises a fourth transistor,
wherein the precharge circuit comprises a fifth transistor,
wherein the first transistor and the second transistor each comprise a metal oxide in a channel formation region,
wherein the third transistor comprises silicon in a channel formation region,
wherein the first transistor and the second transistor each comprise a front gate and a back gate,
wherein the second element layer further comprises a switch circuit,
wherein the switch circuit comprises a first switch,
wherein a bit line provided in a direction perpendicular to the semiconductor substrate is electrically connected to the fourth transistor and the fifth transistor via a sixth transistor, and
wherein an output signal of the error detection circuit is output to the driver circuit through the first switch of the switch circuit.
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