US 12,225,699 B2
Electronic device including shielding and heat dissipation structure
Hyunjoong Yoon, Suwon-si (KR); and Heesoon Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jan. 27, 2023, as Appl. No. 18/160,475.
Application 18/160,475 is a continuation of application No. PCT/KR2021/009578, filed on Jul. 23, 2021.
Claims priority of application No. 10-2020-0096360 (KR), filed on Jul. 31, 2020.
Prior Publication US 2023/0171932 A1, Jun. 1, 2023
Int. Cl. G06F 1/16 (2006.01); H01Q 1/24 (2006.01); H04M 1/02 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01)
CPC H05K 9/0081 (2013.01) [G06F 1/1656 (2013.01); G06F 1/1698 (2013.01); H01Q 1/243 (2013.01); H04M 1/0277 (2013.01); H05K 7/20963 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a printed circuit board;
a first electronic component which is on the printed circuit board;
a first electrical shield extended around the first electronic component, the first electrical shield comprising:
a side wall which extends around the first electronic component, and
an upper portion extending from the side wall to define an opening of the first electrical shield which corresponds to the first electronic component;
a heat diffusion pattern on the first electronic component; and
a shielding sheet which extends across the opening of the first electrical shield and commonly overlaps the first electronic component, the first electrical shield and the heat diffusion pattern,
wherein the shielding sheet comprises:
a first heat diffusion member which is inside the opening of the first electrical shield and contacts the heat diffusion pattern; and
a second heat diffusion member which is attached to the first heat diffusion member, extends across the opening of the first electrical shield and contacts both the upper portion of the first electrical shield and the first heat diffusion member.