US 12,225,697 B2
Display module and display device
Yangyang Cai, Beijing (CN); Hengzhen Liang, Beijing (CN); Zhihao Xie, Beijing (CN); Ying Zhang, Beijing (CN); and Hang Min, Beijing (CN)
Assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 18/022,379
Filed by CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Jun. 30, 2022, PCT No. PCT/CN2022/102790
§ 371(c)(1), (2) Date Feb. 21, 2023,
PCT Pub. No. WO2024/000392, PCT Pub. Date Jan. 4, 2024.
Prior Publication US 2024/0284648 A1, Aug. 22, 2024
Int. Cl. H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20963 (2013.01) [H05K 1/189 (2013.01); H05K 2201/10128 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display module, comprising: a display panel and a flexible printed circuit bonded to the display panel; wherein
the display panel comprises a display area and a non-display area disposed at the periphery of the display area, the non-display area comprises a bonding area disposed on one side of the display area, and a driver integrated circuit (IC) is disposed in the bonding area;
the flexible printed circuit comprises a main body part, an orthographic projection of the main body part onto the display panel is in the bonding area, and a first accommodating groove for accommodating the driver IC is provided in a first surface of the flexible printed circuit close to the display panel; and
a heat dissipation structure, extending from within the first accommodating groove to outside the flexible printed circuit, is further disposed between the flexible printed circuit and the bonding area.