US 12,225,693 B2
Server packaging for immersion cooling with local acceleration
Tianyi Gao, San Jose, CA (US)
Assigned to BAIDU USA LLC, Sunnyvale, CA (US)
Filed by Baidu USA LLC, Sunnyvale, CA (US)
Filed on Mar. 21, 2022, as Appl. No. 17/699,490.
Prior Publication US 2023/0301035 A1, Sep. 21, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/208 (2013.01) [H05K 7/203 (2013.01); H05K 7/20409 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling unit, comprising:
a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis;
an inlet port coupled to a first side of the channel frame to receive a two-phase coolant fluid;
an outlet port coupled to a second side of the channel frame for the two-phase coolant fluid in either a liquid phase or a vapor phase to exit the channel frame;
an internal structure disposed on an inner surface of the channel frame between the inlet port and the outlet port, wherein the internal structure guides the two-phase coolant fluid along a surface of the electronic chip, wherein the electronic chip transfers heat to the two-phase coolant fluid to cause a portion of the two-phase coolant fluid to change from a liquid to a vapor phase; and
a flexible skirt surrounding the channel frame and in contact with the server board, wherein the flexible skirt minimizes leakage of the two-phase coolant through gaps between the cooling unit and the server board.