US 12,225,689 B2
Cooling system for the liquid immersion cooling of electronic components
Achim Gotterbarm, Dornstadt (DE); Manfred Knab, Dornstadt (DE); Jochen Dietl, Ulm (DE); and Harald Gaibler, Rottenacker (DE)
Assigned to WIELAND-WERKE AG, Ulm (DE)
Appl. No. 17/996,446
Filed by WIELAND-WERKE AG, Ulm (DE)
PCT Filed Mar. 30, 2021, PCT No. PCT/EP2021/000031
§ 371(c)(1), (2) Date Oct. 18, 2022,
PCT Pub. No. WO2021/213697, PCT Pub. Date Oct. 28, 2021.
Claims priority of application No. 10 2020 002 530.7 (DE), filed on Apr. 25, 2020.
Prior Publication US 2023/0209771 A1, Jun. 29, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 5/06 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 5/06 (2013.01); H05K 7/20236 (2013.01); H05K 7/20263 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A cooling system for liquid immersion cooling of electronic components, comprising:
a container having an interior and containing, in the interior, liquid heat transfer fluid, the electronic components being immersible in the liquid heat transfer fluid, the container further including a gas space above a surface of the liquid heat transfer fluid;
a heat exchanger device in the gas space of the container for forming the liquid heat transfer fluid;
a lock device on the container for exchanging the electronic components,
the lock device having a lock space,
the lock space being hermetically sealed with respect to the gas space of the container to prevent gas exchange; and
a partition arranged to hermetically seal the lock space, the partition being immersed to an immersion depth in the liquid heat transfer fluid.