US 12,225,683 B2
Thermal module
Tzu-Chih Lin, Hsinchu (TW)
Assigned to ALPHA NETWORKS INC., Hsinchu (TW)
Filed by ALPHA NETWORKS INC., Hsinchu (TW)
Filed on Jul. 12, 2022, as Appl. No. 17/863,209.
Claims priority of application No. 111113909 (TW), filed on Apr. 12, 2022.
Prior Publication US 2023/0328917 A1, Oct. 12, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20172 (2013.01) 9 Claims
OG exemplary drawing
 
1. A thermal module for being disposed in an electronic device, comprising:
a driving device comprising a driving member and a driven member which are connected together, wherein the driving member is adapted to drive the driven member to operate; and
at least one thermal device, wherein the at least one thermal device comprises a fan; two opposite ends of the fan respectively have a mating portion and a connecting portion; the mating portion is adapted to be connected to the driven member, so that the driving member drives the driven member to drive the fan to rotate;
wherein the connecting portion of the fan is adapted to be connected to a mating portion of a fan of another thermal device, so that when the driving member drives the fan of the at least one thermal device to rotate, the fan of the at least one thermal device drives the fan of the another thermal device to rotate;
wherein the at least one thermal device comprises a case; the fan is disposed in the case; the case has an engaging portion adapted to be detachably engaged with an engaging portion of another case.