US 12,225,681 B2
Transceiver handle heat dissipation airflow channeling system
Shree Rathinasamy, Round Rock, TX (US); and Victor Teeter, Round Rock, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Jan. 6, 2023, as Appl. No. 18/094,008.
Prior Publication US 2024/0237266 A1, Jul. 11, 2024
Int. Cl. H05K 7/20 (2006.01); G02B 6/42 (2006.01)
CPC H05K 7/20145 (2013.01) [G02B 6/4269 (2013.01); H05K 7/20163 (2013.01); H05K 7/20409 (2013.01); H05K 7/20454 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A transceiver device, comprising:
a transceiver device chassis;
at least one heat producing component that is housed in the transceiver device chassis; and
a transceiver device handle that extends from the transceiver device chassis, that defines an airflow channel along its length, and that defines an airflow channel entrance to the airflow channel, wherein the transceiver device handle is configured to:
extend, when the transceiver device chassis is positioned in a transceiver device port, past at least one cable such that airflow to the airflow channel via the airflow channel entrance is not obstructed by the at least one cable;
receive airflow at the airflow channel entrance;
direct the airflow through the airflow channel; and
dissipate heat generated by the at least one heat producing component using the airflow directed through the airflow channel.