US 12,225,675 B2
Connection structure
Yasushige Mukunoki, Tokyo (JP); Takeshi Horiguchi, Tokyo (JP); and Hiroki Shigeta, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP); and TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION, Tokyo (JP)
Appl. No. 18/022,752
Filed by Mitsubishi Electric Corporation, Tokyo (JP); and TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION, Tokyo (JP)
PCT Filed Sep. 3, 2020, PCT No. PCT/JP2020/033436
§ 371(c)(1), (2) Date Feb. 23, 2023,
PCT Pub. No. WO2022/049695, PCT Pub. Date Mar. 10, 2022.
Prior Publication US 2023/0320014 A1, Oct. 5, 2023
Int. Cl. H05K 7/14 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01)
CPC H05K 7/1407 (2013.01) [H05K 1/0215 (2013.01); H05K 9/0007 (2013.01); H05K 7/1432 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A connection structure comprising:
a circuit board;
an insulating member to include a first portion fixed to the circuit board and a second portion facing the first portion;
a housing to which the second portion is fixed, the housing including a contact that is grounded; and
a conductive wire to electrically connect the circuit board and the housing while being wound around the insulating member,
wherein a shortest distance along a surface of the housing from a position where the conductive wire and the housing are connected to the contact is shorter than a shortest distance along a surface of the housing from the second portion of the insulating member to the contact.