US 12,225,659 B2
Electronic control device
Miki Hiraoka, Tokyo (JP); and Yoshio Kawai, Hitachinaka (JP)
Assigned to HITACHI ASTEMO, LTD., Hitachinaka (JP)
Appl. No. 17/797,000
Filed by Hitachi Astemo, Ltd., Hitachinaka (JP)
PCT Filed Dec. 25, 2020, PCT No. PCT/JP2020/048668
§ 371(c)(1), (2) Date Aug. 2, 2022,
PCT Pub. No. WO2021/166447, PCT Pub. Date Aug. 26, 2021.
Claims priority of application No. 2020-024134 (JP), filed on Feb. 17, 2020.
Prior Publication US 2023/0054252 A1, Feb. 23, 2023
Int. Cl. H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0224 (2013.01) [H05K 1/0206 (2013.01); H05K 7/2039 (2013.01); H05K 7/205 (2013.01); H05K 2201/066 (2013.01)] 3 Claims
OG exemplary drawing
 
1. An electronic control device comprising:
a housing that dissipates heat of a heat generation element; and
a board that is in contact with the housing wherein the board includes
a heat sink on which the heat generation element is mounted,
a via that penetrates the board in a thickness direction, wherein the via is in thermal contact with the housing via an insulating heat transfer portion that is an insulator,
a first layer formed on a first surface of the board that includes a first non-ground wiring that is in direct contact with the heat sink, and
a second layer that is a layer closest to the first layer in the board, wherein the second layer includes a second ground wiring that is in electrical and thermal contact with the housing,
a fourth layer formed on a second surface of the board, wherein the fourth layer includes a fourth ground wiring that is not in direct contact with the via but is in electrical and thermal contact with the housing and
a third layer that is an inner layer closest to the fourth layer, wherein the third layer includes a third non-ground wiring that is in direct contact with the via;
wherein:
a potential of the housing is a ground,
a potential of the heat sink is a non-ground,
the first non-ground wiring and the second ground wiring overlap each other in plan view from the thickness direction of the board, and
the third non-ground wiring and the fourth ground wiring overlap each other in the plan view from the thickness direction of the board.