US 12,225,341 B2
Open-ear headphone
Thomas Chambers, Bellingham, MA (US); and Caitlin Hanson, Westborough, MA (US)
Assigned to Bose Corporation, Framingham, MA (US)
Filed by Bose Corporation, Framingham, MA (US)
Filed on Sep. 1, 2023, as Appl. No. 18/241,293.
Application 18/241,293 is a continuation of application No. 17/587,761, filed on Jan. 28, 2022, granted, now 11,856,356.
Prior Publication US 2023/0412966 A1, Dec. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/1058 (2013.01) [H04R 1/1016 (2013.01); H04R 1/1025 (2013.01); H04R 1/1041 (2013.01); H04R 2460/09 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flexible arm that is configured to be located between and physically and electrically connect an acoustic module of an open-ear headphone to a battery housing of the open-ear headphone, wherein the flexible arm defines an original resting length and an original resting position that lies along a longitudinal axis between the acoustic module and the battery housing, the flexible arm comprising:
a flexible printed circuit that extends through the entire original resting length of the flexible arm and comprises a conductor that is configured to carry electrical energy between the acoustic module and the battery housing, wherein the flexible printed circuit within the flexible arm is curved relative to the longitudinal axis, such that a length of the flexible printed circuit within the flexible arm is greater than the original resting length of the flexible arm; and
a flexible material that encases at least some of the flexible printed circuit.