| CPC H03H 9/02574 (2013.01) [H03H 9/02559 (2013.01); H03H 9/02637 (2013.01); H03H 9/02866 (2013.01); H03H 9/02984 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01)] | 12 Claims |

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1. An acoustic wave device comprising:
a silicon support substrate;
a silicon nitride film on the support substrate;
a silicon oxide film on the silicon nitride film;
a piezoelectric layer on the silicon oxide film and made of Y-cut X-SAW propagation lithium tantalate; and
an IDT electrode directly or indirectly on the piezoelectric layer and including a plurality of electrode fingers; wherein
when a wavelength defined by an electrode finger pitch of the IDT electrode is λ, a film thickness of the piezoelectric layer is equal to or less than about 1λ;
Euler angles of the piezoelectric layer are (about 0±5°, θ, about 0±5°) or (about 0±5°, θ, about 180±5°), and θ in the Euler angles of the piezoelectric layer is about 95.5°≤θ<117.5° or about −84.5°≤θ<−62.5°; and
a relationship between θ in the Euler angles of the piezoelectric layer and a film thickness of the silicon nitride film is a combination shown in Table 1 or Table 2 below:
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and
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