US 12,224,730 B2
Manufacturing method of a composite substrate of an acoustic wave resonator
Herb He Huang, Zhejiang (CN); Hailong Luo, Zhejiang (CN); Wei Li, Zhejiang (CN); and Fei Qi, Zhejiang (CN)
Assigned to NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION, Zhejiang (CN)
Appl. No. 17/618,690
Filed by NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION, Zhejiang (CN)
PCT Filed Jul. 1, 2020, PCT No. PCT/CN2020/099638
§ 371(c)(1), (2) Date Dec. 13, 2021,
PCT Pub. No. WO2021/139117, PCT Pub. Date Jul. 15, 2021.
Claims priority of application No. 202010018484.8 (CN), filed on Jan. 8, 2020.
Prior Publication US 2022/0247375 A1, Aug. 4, 2022
Int. Cl. H03H 3/08 (2006.01); H03H 9/25 (2006.01)
CPC H03H 3/08 (2013.01) [H03H 9/25 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A manufacturing method of a composite substrate of an acoustic wave resonator, comprising:
providing a base, wherein the base comprises a first surface and a second surface that are opposite to each other; and
a first groove sunken towards the second surface is formed on the first surface; and
providing a piezoelectric plate and embedding the piezoelectric plate into the first groove, wherein the piezoelectric plate is matched with the first groove in shape, and a bottom of the first groove is integrated with the piezoelectric plate by bonding;
forming a protrusion on the bottom of the first groove, and forming a second groove on a bottom of the piezoelectric plate; or, forming the second groove on the bottom of the first groove, and forming the protrusion on the bottom of the piezoelectric plate,
wherein the protrusion and the second groove are matched in shape, and positioned in a non-device region of the composite substrate; and
wherein when the piezoelectric plate is embedded into the first groove, the second groove and the protrusion are clamped together.