US 12,224,552 B2
Optical module
Daisuke Noguchi, Tachikawa (JP); and Hiroshi Yamamoto, Inagi (JP)
Assigned to CIG PHOTONICS JAPAN LIMITED, Kanagawa (JP)
Filed by CIG Photonics Japan Limited, Kanagawa (JP)
Filed on Feb. 4, 2022, as Appl. No. 17/592,606.
Claims priority of application No. 2021-031654 (JP), filed on Mar. 1, 2021.
Prior Publication US 2022/0278500 A1, Sep. 1, 2022
Int. Cl. H01S 3/04 (2006.01); H01S 5/02212 (2021.01); H01S 5/0231 (2021.01); H01S 5/02315 (2021.01); H01S 5/02345 (2021.01); H01S 5/0239 (2021.01); H01S 5/062 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/042 (2006.01)
CPC H01S 5/02345 (2021.01) [H01S 5/02212 (2013.01); H01S 5/0231 (2021.01); H01S 5/02315 (2021.01); H01S 5/0239 (2021.01); H01S 5/06226 (2013.01); H01S 5/02415 (2013.01); H01S 5/0265 (2013.01); H01S 5/0427 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An optical module comprising:
a photoelectric device configured to convert an optical signal and an electrical signal at least from one to another;
a mounting substrate on which the photoelectric device is mounted;
a support block on which the mounting substrate is mounted and at least a surface of which is made of a conductor;
a stem having a support surface to support the support block, the stem having a pedestal portion projecting integrally from the support surface, the pedestal portion having a tip face in a protruding direction and an upper surface spreading along the protruding direction;
a relay board mounted on the upper surface of the pedestal portion;
a connection block fixed to the tip face of the pedestal portion; and
a plurality of wires, each wire of the plurality of wires connecting a corresponding one of the support block or the mounting substrate to the connection block,
the connection block having a first bonding surface facing a same direction as the tip face of the pedestal portion, and a second bonding surface facing a same direction as the upper surface, and
the plurality of wires including at least one first wire having one end bonded to the first bonding surface and at least one second wire having one end bonded to the second bonding surface.