US 12,224,534 B2
Wiring component with temperature sensor
Keisuke Fukuchi, Tokyo (JP); and Junjie Shen, Ibaraki (JP)
Assigned to Proterial, Ltd., Tokyo (JP); and Hitachi Astemo, Ltd., Ibaraki (JP)
Filed by Proterial, Ltd., Tokyo (JP); and Hitachi Astemo, Ltd., Ibaraki (JP)
Filed on Dec. 16, 2021, as Appl. No. 17/552,710.
Claims priority of application No. 2021-005053 (JP), filed on Jan. 15, 2021.
Prior Publication US 2022/0231467 A1, Jul. 21, 2022
Int. Cl. H01R 13/66 (2006.01); G01K 1/08 (2021.01); G01K 1/14 (2021.01); G01K 7/22 (2006.01); H01R 13/405 (2006.01); H01R 13/504 (2006.01); H02G 3/04 (2006.01)
CPC H01R 13/6683 (2013.01) [G01K 1/08 (2013.01); G01K 1/14 (2013.01); G01K 7/22 (2013.01); H01R 13/405 (2013.01); H01R 13/504 (2013.01); H02G 3/0456 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A wiring component with temperature sensor, comprising:
an electric wire as a temperature measurement target object;
a temperature sensor comprising a detection unit configured to detect temperature of the electric wire and a plurality of lead wires; and
a plurality of connector pins respectively connected to the plurality of lead wires,
wherein the electric wire, the temperature sensor and the plurality of connector pins are collectively held by a holder comprising a resin, and
wherein the holder comprises a connector housing member configured to hold the plurality of connector pins and a molded resin member covering a portion of the connector housing member,
wherein the holder comprises an electric wire holding member configured to hold the electric wire and a sensor holding member configured to hold the temperature sensor, and wherein the electric wire holding member and the sensor holding member, together with the connector housing member, are integrated by the molded resin member, and
wherein the temperature sensor does not directly contact the sensor mold resin member.