US 12,224,510 B2
Connector including signal pins shielded by buried ground vias
Woody Maynard, State College, PA (US); Mayuresh Patki, Harrisburg, PA (US); David Chen, Los Altos, CA (US); and Gary Hsieh, Taoyuan (TW)
Assigned to Neoconix, Inc., San Jose, CA (US)
Filed by Neoconix, Inc., San Jose, CA (US)
Filed on Jan. 30, 2024, as Appl. No. 18/426,368.
Application 18/426,368 is a continuation of application No. 17/495,770, filed on Oct. 6, 2021, granted, now 11,967,782.
Claims priority of provisional application 63/113,128, filed on Nov. 12, 2020.
Prior Publication US 2024/0170867 A1, May 23, 2024
Int. Cl. H01R 12/52 (2011.01); H01R 12/57 (2011.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01); H01R 13/6471 (2011.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 7/10 (2006.01)
CPC H01R 12/52 (2013.01) [H01R 12/57 (2013.01); H01R 12/714 (2013.01); H01R 13/2407 (2013.01); H01R 13/6471 (2013.01); H05K 1/0219 (2013.01); H05K 3/4092 (2013.01); H05K 7/1069 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A connector for electrically connecting to conductive structures formed on an electronic component, comprising:
a core comprising a first ground plane, a second ground plane, and a third ground plane, the first, second and third ground planes being isolated from each other, the core further comprising a plurality of signal vias and a plurality of ground vias, each ground vias being electrically connected to at least one of the first, second or third ground plane;
conductive signal traces formed coplanar with the second ground plane and isolated from a conductive ground layer forming the second ground plane, each conductive signal trace having a first end and a second end, one or more conductive signal traces forming a group of traces being shielded by the conductive ground layer of the second ground plane and further being shielded by the first and third ground planes;
a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias that are electrically connected to the first ends of the conductive signal traces to form a first set of signal pins; and
a second set of contact elements formed on the first surface of the core and electrically connected to the signal vias that are electrically connected to the second ends of the conductive signal traces to form a second set of signal pins, the signal vias and the contact elements in the first and second sets being electrically isolated from the first, second and third ground planes.