US 12,224,504 B2
Antenna arrangement and communication device
Janne Ilvonen, Helsinki (FI); Jari-Matti Hannula, Espoo (FI); Riku Kormilainen, Espoo (FI); Anu Lehtovuori, Espoo (FI); Rasmus Luomaniemi, Espoo (FI); Ville Viikari, Espoo (FI); Alexander Khripkov, Helsinki (FI); and Joonas Krogerus, Helsinki (FI)
Assigned to Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed on Oct. 27, 2022, as Appl. No. 17/975,253.
Application 17/975,253 is a continuation of application No. PCT/EP2020/061638, filed on Apr. 27, 2020.
Prior Publication US 2023/0118728 A1, Apr. 20, 2023
Int. Cl. H01Q 1/24 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 9/0414 (2013.01) [H01Q 9/0421 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An antenna arrangement for a communication device, the antenna arrangement comprising:
a substrate having a top surface and a bottom surface;
a top conductive patch arranged on the top surface, the top conductive patch comprising a first section and a second section adjoining the first section;
a bottom conductive patch arranged on the bottom surface opposite to the top conductive patch; and
one or more feed circuits configured to carry a radio frequency (RF) signal to or from the top conductive patch,
wherein the top conductive patch comprises a plurality of coupling points at which the top conductive patch is coupled to the one or more feed circuits, the plurality of coupling points comprising:
a first coupling point located in the first section and a second coupling point located in the second section such that the RF signal has a first phase at the first coupling point and a second phase at the second coupling point, and
a third coupling point located in the first section and a fourth coupling point located in the second section such that the RF signal has a third phase at the third coupling point and a fourth phase at the fourth coupling point, and
wherein a first slot extends in the top conductive patch between the first coupling point and the second coupling point and a second slot extends in the top conductive patch between the third coupling point and the fourth coupling point.