US 12,224,490 B2
Horn antenna for millimeter wave
Byoung Nam Kim, Suwon-si (KR); Hong Il Yoo, Gwangmyeong-si (KR); Chul-Keun Park, Seongnam-si (KR); Chan-Woo Park, Seoul (KR); and Kyung Hwan Kim, Anyang-si (KR)
Assigned to SENSORVIEW CO., LTD., Seongnam-si (KR)
Filed by SENSORVIEW CO., LTD., Seongnam-si (KR)
Filed on Feb. 21, 2023, as Appl. No. 18/171,725.
Claims priority of application No. 10-2022-0024188 (KR), filed on Feb. 24, 2022.
Prior Publication US 2023/0282983 A1, Sep. 7, 2023
Int. Cl. H01Q 13/02 (2006.01); H01P 5/107 (2006.01); H01Q 21/00 (2006.01)
CPC H01Q 13/0233 (2013.01) [H01P 5/107 (2013.01); H01Q 21/0062 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A horn antenna for a millimeter wave, the horn antenna comprising:
a horn radiator including a radiation part having an opening formed therein to radiate a feed signal, and a multi-layer PCB coupling part coupled to lower and side portions of the radiation part to provide a feed signal; and
a multi-layer PCB coupled to a lower portion of the multi-layer PCB coupling part to provide a feed signal,
wherein a slot and a groove connected to the slot and extending in a direction parallel to the multi-layer PCB are formed in the multi-layer PCB coupling part,
wherein a feed line vertically overlapping the slot and the groove is formed on a first layer substrate, which is the uppermost layer of the multi-layer PCB,
wherein the opening extends in a direction parallel to the multi-layer PCB, and wherein a ‘¬’-shaped waveguide extending from the slot is formed in the horn radiator,
wherein a patch is formed at an end of the feed line, and the patch is arranged to vertically overlap the slot,
wherein a first ground plane is formed on the first layer substrate, a first slot region is formed on the first ground plane, and the feed line is disposed in the first slot region, and
wherein a second layer substrate is coupled to a lower portion of the first layer substrate, a second ground plane is formed on the second layer substrate, a second slot region is formed on the second ground plane, a matching patch is disposed in the second slot region, and the matching patch is disposed to vertically overlap the patch.