| CPC H01Q 1/243 (2013.01) [H04B 1/006 (2013.01)] | 18 Claims | 

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               1. A microminiaturized antenna feed module applied in an electronic device having a metal frame, comprising: 
            a substrate defining a plurality of vias penetrating the substrate; 
                an active circuit disposed on a first surface of the substrate and configured to switch radiation modes; and 
                a plurality of coupled feed portions disposed on a second surface of the substrate and having different coupling areas; 
                wherein the second surface is opposite to the first surface, the plurality of coupled feed portions, made of conductive material, electrically connect to the active circuit through the plurality of vias to feed in electrical signals and the plurality of coupled feed portions couple the electrical signals to the metal frame to radiate wireless signals, an area allocation of the plurality of coupled feed portions is adjustable in proportion to a bandwidth requirement. 
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