US 12,224,480 B2
Microelectronic device package including antenna horn and semiconductor device
Yiqi Tang, Allen, TX (US); and Rajen Manicon Murugan, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on May 4, 2022, as Appl. No. 17/736,653.
Claims priority of provisional application 63/192,548, filed on May 24, 2021.
Prior Publication US 2022/0376378 A1, Nov. 24, 2022
Int. Cl. H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01Q 9/04 (2006.01); H01Q 13/02 (2006.01); H01Q 19/10 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 23/66 (2013.01); H01Q 9/0407 (2013.01); H01Q 13/02 (2013.01); H01Q 19/10 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a patch antenna formed in a first conductor layer of a multilayer package substrate, the multilayer package substrate comprising conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite a device side surface;
a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the patch antenna; and
an antenna horn mounted to the device side surface and aligned with the patch antenna.