US 12,224,476 B2
High frequency assembly
Ulf Hügel, Herisau (CH)
Assigned to HUBER+SUHNER AG, Herisau (CH)
Appl. No. 17/775,961
Filed by HUBER+SUHNER AG, Herisau (CH)
PCT Filed Nov. 17, 2020, PCT No. PCT/EP2020/082360
§ 371(c)(1), (2) Date May 11, 2022,
PCT Pub. No. WO2021/099300, PCT Pub. Date May 27, 2021.
Claims priority of application No. 01470/19 (CH), filed on Nov. 21, 2019.
Prior Publication US 2022/0393331 A1, Dec. 8, 2022
Int. Cl. H01P 3/16 (2006.01); H01P 1/161 (2006.01); H04B 10/2507 (2013.01)
CPC H01P 3/16 (2013.01) [H01P 1/161 (2013.01); H04B 10/2507 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A high-frequency assembly, including:
a cable, the cable including at least one dielectric waveguide fiber with a first end and an opposed second end;
a high-frequency circuit;
an interface unit, wherein the at least one dielectric waveguide fiber is at the first end operatively coupled with the high-frequency circuit via the interface unit;
wherein the interface unit is designed to inject a high-frequency signal into the dielectric waveguide fiber and/or to receive a high-frequency signal from the at least one dielectric waveguide fiber at the first end;
wherein the high-frequency signal has a first signal component of a first polarization direction and a second signal component of a second polarization direction, wherein the high-frequency assembly is designed to inject the first signal component and the second signal component in a defined manner and/or to split a received high-frequency signal into the first signal component and the second signal component;
wherein the at least one dielectric waveguide fiber is a polymeric microwave fiber (PMF); and
wherein the high-frequency assembly is designed to evaluate a first signal level of the first signal component and a second signal level of the second signal component.