US 12,224,475 B2
Integrated thick film spacer for RF devices
Keely M. Musgrove, Allen, TX (US); and Mark B. Hanna, Allen, TX (US)
Assigned to RAYTHEON COMPANY, Waltham, MA (US)
Filed by Raytheon Company, Tewksbury, MA (US)
Filed on Dec. 12, 2023, as Appl. No. 18/536,908.
Application 18/536,908 is a division of application No. 17/154,255, filed on Jan. 21, 2021, granted, now 11,881,610.
Prior Publication US 2024/0113407 A1, Apr. 4, 2024
Int. Cl. H01P 1/387 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B41M 1/12 (2006.01); H01P 1/36 (2006.01); H01P 1/38 (2006.01); H01P 11/00 (2006.01)
CPC H01P 1/38 (2013.01) [B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 37/12 (2013.01); B32B 38/145 (2013.01); B41M 1/12 (2013.01); H01P 1/36 (2013.01); H01P 1/387 (2013.01); H01P 11/00 (2013.01); H01P 11/003 (2013.01); B32B 2255/06 (2013.01); B32B 2307/20 (2013.01); B32B 2457/00 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A magnetically controlled signal distribution device comprising:
a substrate having an upper surface;
a screen printed low-k dielectric spacer over the upper surface of the substrate, wherein the spacer is formed from a low-k dielectric paste and is directly on the upper surface of the substrate;
an adhesive layer on top of the spacer; and
a magnet secured to a top of the adhesive layer.