US 12,224,390 B2
Electronic component mounting substrate and electronic device
Kouichirou Sugai, Kyoto (JP); and Kazuki Nishimoto, Kyoto (JP)
Assigned to KYOCERA CORPORATION, Kyoto (JP)
Appl. No. 17/914,031
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Mar. 23, 2021, PCT No. PCT/JP2021/011931
§ 371(c)(1), (2) Date Sep. 23, 2022,
PCT Pub. No. WO2021/193607, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-058032 (JP), filed on Mar. 27, 2020.
Prior Publication US 2023/0123973 A1, Apr. 20, 2023
Int. Cl. H01L 33/00 (2010.01); H01L 31/024 (2014.01); H01L 33/64 (2010.01); H01S 5/02315 (2021.01); H01S 5/024 (2006.01)
CPC H01L 33/644 (2013.01) [H01L 31/024 (2013.01); H01S 5/02315 (2021.01); H01S 5/02469 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An electronic component mounting substrate, comprising: a metal substrate comprising a first surface; an insulation substrate comprising a second surface having at least one metal layer having a thickness projecting therefrom that covers a portion of the second surface such that the second surface is divided into an area covered by the at least one metal layer and an area uncovered by any metal layer the at least one metal layer including a first metal layer having a frame shape disposed proximate a perimeter of the insulation substrate second surface and surrounding a portion of the uncovered area; and a layer of bonding material that bonds the first surface and the first metal layer that extends beneath the first metal layer and the area the first metal layer surrounds and that extends upwardly in the portion of the uncovered area that is surrounded by the frame shape less than the projecting thickness of the first metal layer whereby the bonding layer absorbs stress due to differential heat expansion characteristics between the metal substrate and the insulation substrate.