US 12,224,383 B2
Light-emitting device and manufacturing method of the same
Satoshi Ando, Tokyo-to (JP); and Ji-Hao Liang, Tokyo-to (JP)
Assigned to STANLEY ELECTRIC CO., LTD., Tokyo (JP)
Filed by STANLEY ELECTRIC CO., LTD., Tokyo (JP)
Filed on Feb. 18, 2022, as Appl. No. 17/675,668.
Claims priority of application No. 2021-025975 (JP), filed on Feb. 22, 2021.
Prior Publication US 2022/0271203 A1, Aug. 25, 2022
Int. Cl. H01L 33/10 (2010.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01)
CPC H01L 33/505 (2013.01) [H01L 33/0093 (2020.05); H01L 33/10 (2013.01); H01L 33/56 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/005 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A light-emitting device comprising:
a substrate;
a frame body disposed on an upper surface of the substrate, the frame body extending along a periphery of the substrate;
a light-emitting element including a support substrate disposed on the substrate and a semiconductor light-emitting layer formed on an upper surface of the support substrate;
a wavelength converter disposed on an upper surface of the light-emitting element; and
a light reflecting portion covering side surfaces of the light-emitting element and the wavelength converter and being formed of a translucent resin containing light reflective particulate fillers, wherein
the light reflecting portion includes a first region extending along an upper surface of the light reflecting portion, a second region that is disposed under the first region and has a content rate of the particulate fillers lower than a content rate of the first region, and a third region that is disposed under the second region and has a content rate of the particulate fillers lower than the content rate of the second region.