US 12,224,373 B2
Micro-LED structure and micro-LED chip including same
Qiming Li, Albuquerque, NM (US); Yuankun Zhu, Shanghai (CN); Anle Fang, Shanghai (CN); Deshuai Liu, Shanghai (CN); and Jian Guo, Shanghai (CN)
Assigned to JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed by JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed on Dec. 27, 2021, as Appl. No. 17/562,404.
Claims priority of provisional application 63/131,128, filed on Dec. 28, 2020.
Prior Publication US 2022/0209059 A1, Jun. 30, 2022
Int. Cl. H01L 33/06 (2010.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/02 (2010.01); H01L 33/04 (2010.01); H01L 33/10 (2010.01); H01L 33/20 (2010.01); H01L 33/24 (2010.01); H01L 33/38 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/36 (2010.01)
CPC H01L 33/06 (2013.01) [H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 27/153 (2013.01); H01L 33/02 (2013.01); H01L 33/04 (2013.01); H01L 33/10 (2013.01); H01L 33/20 (2013.01); H01L 33/24 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A micro-LED chip including multiple micro-LEDs, wherein,
at least one micro-LED of the multiple micro-LEDs comprises:
a first type conductive layer;
a second type conductive layer stacked on the first type conductive layer; and
a light emitting layer formed between the first type conductive layer and the second type conductive layer, at least one part of the light emitting layer being formed between adjacent micro-LEDs, and
the micro-LED chip further comprises a metal layer formed on the light emitting layer between the adjacent micro-LEDs, wherein a bottom surface of the metal layer is horizontally aligned with a bottom surface of the second type conductive layer.