US 12,224,366 B2
Manufacturing method and manufacturing apparatus for interconnection member
Hua Li, Jiangsu (CN); Yong Wang, Jiangsu (CN); Peng Chen, Jiangsu (CN); Debao Zhao, Jiangsu (CN); Jun Chen, Jiangsu (CN); and Jiyu Liu, Jiangsu (CN)
Assigned to LONGI SOLAR TECHNOLOGY (TAIZHOU) CO., LTD., Jiangsu (CN)
Appl. No. 18/023,518
Filed by LONGI SOLAR TECHNOLOGY (TAIZHOU) CO., LTD., Jiangsu (CN)
PCT Filed Nov. 23, 2020, PCT No. PCT/CN2020/130886
§ 371(c)(1), (2) Date Feb. 27, 2023,
PCT Pub. No. WO2022/041515, PCT Pub. Date Mar. 3, 2022.
Claims priority of application No. 202010901302.1 (CN), filed on Aug. 31, 2020.
Prior Publication US 2023/0275172 A1, Aug. 31, 2023
Int. Cl. H01L 31/05 (2014.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01)
CPC H01L 31/0516 (2013.01) [H01L 31/0201 (2013.01); H01L 31/18 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An interconnection piece applied to back-contact cell interconnection, wherein the interconnection piece comprises: a flexible insulating substrate and a plurality of structural solder strips arranged on the flexible insulating substrate at intervals; and a material of the flexible insulating substrate comprises an insulating polymer material, wherein the insulating polymer material comprises at least one of polyvinyl butyral (PVB), polyolefin (POE) and ethylene-vinyl acetate copolymer (EVA); and each structural solder strip is provided with two soldering portions and a connecting portion located between the two soldering portions,
wherein the flexible insulating substrate is internally provided with a conducting layer, and the connecting portion of each structural solder strip is positioned on the conducting layer and directly electrically contacts the conducting layer.