US 12,224,359 B2
Sensor package structure having solder mask frame
Fu-Chou Liu, Hsin-Chu County (TW); Jui-Hung Hsu, Hsin-Chu County (TW); Yu-Chiang Peng, Hsin-Chu County (TW); Chien-Chen Lee, Hsin-Chu County (TW); Ya-Han Chang, Hsin-Chu County (TW); and Li-Chun Hung, Hsin-Chu County (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed on Feb. 16, 2023, as Appl. No. 18/110,637.
Application 18/110,637 is a division of application No. 16/920,492, filed on Jul. 3, 2020, abandoned.
Claims priority of application No. 109110135 (TW), filed on Mar. 26, 2020.
Prior Publication US 2023/0207709 A1, Jun. 29, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 31/02 (2006.01); H01L 31/0203 (2014.01)
CPC H01L 31/02002 (2013.01) [H01L 31/0203 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A sensor package structure, comprising:
a substrate having a first board surface and a second board surface that is opposite to the first board surface;
a plurality of solder balls mounted on the first board surface;
a sensor chip disposed on the first board surface and electrically coupled to the substrate, wherein a top surface of the sensor chip includes a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 μm, and wherein the sensor chip includes a plurality of internal contacts arranged on a bottom surface thereof and a plurality of conducting paths that extend from the top surface to the bottom surface, the conducting paths are respectively connected to the internal contacts and are electrically coupled to the sensing region, and the internal contacts are soldered onto the first board surface of the substrate through the solder balls, such that the bottom surface of the sensor chip is spaced apart from the first board surface of the substrate through the solder balls;
a ring-shaped solder mask frame disposed on the first board surface of the substrate, wherein the ring-shaped solder mask frame surrounds the outer lateral side of the sensor chip, and the ring-shaped solder mask frame is integrally formed as a one-piece structure that is gaplessly connected to an entirety of the outer lateral side of the sensor chip and that has a top side being coplanar with the top surface of the sensor chip, thereby providing an extension for the sensor chip, wherein a distance between a bottom side of the ring-shaped solder mask frame and the first board surface of the substrate is less than a distance between the bottom surface of the sensor chip and the first board surface of the substrate, and wherein the ring-shaped solder mask frame, the sensor chip, and the substrate jointly define a space accommodating the solder balls that are not in contact with the ring-shaped solder mask frame;
a ring-shaped support that is disposed on a top side of the ring-shaped solder mask frame and that is not in contact with the sensor chip; and
a light permeable member having a first surface and a second surface that is opposite to the first surface and that is disposed on the ring-shaped support, wherein the light permeable member is spaced apart from the top surface of the sensor chip through the ring-shaped sport support, whereby the second surface of the light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space, and the sensor region is located in the enclosed space.