US 12,224,343 B2
Power device with partitioned active regions
Amaury Gendron-Hansen, Bend, OR (US); Dumitru Gheorge Sdrulla, Bend, OR (US); and Leslie Louis Szepesi, Bend, OR (US)
Assigned to Analog Power Conversion LLC, Bend, OR (US)
Filed by Analog Power Conversion LLC, Bend, OR (US)
Filed on Jul. 13, 2021, as Appl. No. 17/374,706.
Prior Publication US 2023/0012738 A1, Jan. 19, 2023
Int. Cl. H01L 29/78 (2006.01); H01L 27/088 (2006.01); H01L 29/47 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01)
CPC H01L 29/7827 (2013.01) [H01L 27/0886 (2013.01); H01L 29/47 (2013.01); H01L 29/4916 (2013.01); H01L 29/78684 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor device having a first surface and a second surface opposite the first surface, the semiconductor device comprising:
a substrate;
an epitaxial layer formed over the substrate;
a plurality of active regions disposed over the substrate and formed in the epitaxial layer, the plurality of active regions having a first total area; and
a plurality of cells of an active device comprising a silicon carbide Metal-Oxide-Semiconductor Field Effect Transistor, the plurality of cells respectively disposed in the plurality of active regions;
a plurality of control pads disposed over the first surface and respectively electrically coupled to gate electrodes of the plurality of cells;
a plurality of source pads disposed over the first surface and respectively electrically coupled to source electrodes of the plurality of cells;
a drain contact disposed over the second surface and electrically coupled to drain electrodes of the plurality of cells;
one or more inactive regions disposed over the substrate and between respective pairs of the active regions, the one or more inactive regions having a second total area,
wherein the second total area is greater than or equal to 1.5 times the first total area,
wherein a first half of the plurality of control pads are disposed along a first side of the semiconductor device,
wherein a second half of the plurality of control pads are disposed along a second side of the semiconductor device, and
wherein the first side is on an opposite side of the semiconductor device of the second side.