US 12,224,303 B2
Manufacturing method of photoelectric conversion panel, photoelectric conversion panel, and X-ray panel
Makoto Nakazawa, Kameyama (JP); Hiroyuki Moriwaki, Kameyama (JP); Rikiya Takita, Kameyama (JP); and Tetsuya Tanishima, Kameyama (JP)
Assigned to Sharp Display Technology Corporation, Kameyama (JP)
Filed by Sharp Display Technology Corporation, Kameyama (JP)
Filed on May 15, 2023, as Appl. No. 18/197,117.
Claims priority of application No. 2022-084818 (JP), filed on May 24, 2022.
Prior Publication US 2023/0387177 A1, Nov. 30, 2023
Int. Cl. H01L 27/146 (2006.01); G01T 1/20 (2006.01)
CPC H01L 27/14689 (2013.01) [G01T 1/2018 (2013.01); H01L 27/14636 (2013.01); H01L 27/14663 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A manufacturing method of a photoelectric conversion panel comprising:
forming a transistor on a substrate;
forming a photodiode at an upper layer overlying the transistor;
forming a first insulating film configured to cover the photodiode;
forming a first flattening film configured to cover the first insulating film;
forming a first hole portion configured to expose a part of an upper face of the photodiode in the first flattening film and the first insulating film;
forming a second hole portion configured to expose a source electrode of the transistor or a connection electrode connected to the source electrode in the first flattening film and the first insulating film;
forming a second insulating film configured to cover the first flattening film, a part of the second insulating film being disposed in each of the first hole portion and the second hole portion;
forming a third hole portion in the second insulating film disposed in the first hole portion;
forming a fourth hole portion in the second insulating film disposed in the second hole portion;
forming a bias line at an upper layer overlying the second insulating film, a part of the bias line being disposed in the third hole portion; and
forming a data line at an upper layer overlying the second insulating film, a part of the data line being disposed in the fourth hole portion.