US 12,224,299 B2
Sensor package structure
Chien-Chen Lee, Hsin-Chu County (TW); Li-Chun Hung, Hsin-Chu County (TW); and Chien-Yuan Wang, Hsin-Chu County (TW)
Assigned to TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei (TW)
Filed by KINGPAK TECHNOLOGY INC., Hsin-Chu County (TW)
Filed on Apr. 14, 2022, as Appl. No. 17/720,398.
Claims priority of application No. 110149595 (TW), filed on Dec. 30, 2021.
Prior Publication US 2023/0215896 A1, Jul. 6, 2023
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 27/14618 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A sensor package structure, comprising:
a substrate having a first surface and a second surface that is opposite to the first surface, wherein the first surface of the substrate has a chip-bonding region and a connection region that surrounds the chip-bonding region, and the substrate has a plurality of protrusions arranged on the connection region;
a sensor chip disposed on the chip-bonding region of the substrate and electrically coupled to the substrate;
a ring-shaped wall formed on the connection region of the substrate, wherein the protrusions of the substrate are embedded in and gaplessly connected to the ring-shaped wall;
a light-permeable layer disposed on the ring-shaped wall, wherein the light-permeable layer, the ring-shaped wall, and the substrate jointly define an enclosed space therein; and
a ring-shaped stopping rib disposed on the first surface of the substrate, wherein the ring-shaped stopping rib is located between the protrusions and the soldering pads, and wherein the ring-shaped stopping rib is located adjacent to the protrusions and is lower than any one of the protrusions with respect to the first surface.